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Xiaomin Wei

Publications and source records attributed to Xiaomin Wei.

9 recordsLinked to original sources

Arbitrary Control of Non-Hermitian Skin Modes via Disorder and An Electric Field

The non-Hermitian skin effect (NHSE), characterized by the accumulation of a macroscopic number of bulk states at system boundaries, is a hallmark of non-Hermitian physics. However, in higher dimensions, achieving deterministic control over where skin modes accumulate remains a major challenge. Here, we propose a versatile route to program the skin-mode localization site in two-dimensional non-Hermitian lattices by combining disorder with a static electric field. While the electric field alone suppresses the NHSE in a clean system, the introduction of disorder induces transverse wave-packet transport perpendicular to the field. In nonreciprocal lattices, when the nonreciprocal hopping is misaligned with the electric field, the hopping component perpendicular to the field guides wave-packet propagation and produces boundary localization. By tuning the relative orientation between the electric field and the nonreciprocal hopping direction, the boundary localization position can be continuously and arbitrarily controlled. We further demonstrate distinct geometry-dependent manipulation of skin modes in reciprocal lattices, where controllable boundary localization emerges solely from the lattice geometry. Our results establish a robust and broadly applicable route to engineer boundary accumulation and directed transport along prescribed directions in two-dimensional non-Hermitian systems, enabling reconfigurable wave routing in classical platforms and programmable transport functionalities in quantum settings.

cond-mat.dis-nn

Behavioral-Level Simulation of Digital Readout for COFFEE at LHCb Upstream Pixel Tracker

COFFEE series is a HVCMOS pixel sensor using the advanced 55 nm process, currently being developed for the Upstream Pixel (UP) tracker of the LHCb Upgrade II. To ensure that COFFEE will be able to handle the particle hit rates at UP tracker, which reach a maximum of 322.5 MHz/chip, detailed simulation of the digital readout circuitry was performed. Simulation results show that the column-drain readout mechanism achieves nearly 100\% efficiency when the single readout cycle does not exceed 100 ns. Meanwhile, the buffer depth and memory resources required for the peripheral readout adapted to the BXID-sharing data format are also evaluated. These provide guidance for the design of COFFEE. The column-drain readout mechanism was used in COFFEE3 (fabricated in 2025), while the peripheral readout architecture adapted to the BXID-sharing data format is implemented in CHiR (taped out in early 2026).

physics.ins-det

Design and First Results of COFFEE3: A 55nm HVCMOS Pixel Sensor Prototype for High-Energy Physics Applications

Motivated by the stringent requirements of the Upstream Pixel (UP) tracker in the LHCb Upgrade II and the Inner Tracking detector (ITK) of the Circular Electron Positron Collider, the COFFEE series of pixel sensor chips have been developed using a 55nm High-Voltage CMOS (HVCMOS) process. The primary objective is to achieve a time resolution of a few nanoseconds under a hit density of up to 100 MHz/cm$^2$, while maintaining fine spatial resolution ($\sim$10 $μ$m) and reasonable power consumption ($<$200 mW/cm$^2$). Building on the process validation of the COFFEE2 prototype, this work presents the design and preliminary test results of COFFEE3-a prototype integrating two distinct readout architectures. Architecture 1, tailored for the current triple-well process, adopts NMOS-only in-pixel circuitry and innovative column-level readout to handle high hit densities. The time walk of pixel-level signal is controlled within 10 ns, and the Time of Arrival (TOA) and Time over Threshold (TOT) are measured with a system clock with the period of 25 ns in peripheral circuits. Architecture 2, developed for future possible processes with p-type buried layer isolation, features pixel-level time measurement and storage. A chip-level Time-to-Digital Converter (TDC) is used and the part of Voltage-Controlled Delay Line (VCDL) is copied in each pixel to get a high time resolution. The TOA resolution is estimated to be 4.2 ns and the TOT resolution 8.4 ns. COFFEE3, with a layout size of 3$\times$4 mm$^2$, was manufactured and has undergone preliminary tests. Charge injection tests for analog circuits, and laser tests for full readout chains, confirm that both architectures operate as expected. Next step work will focus on characterizing key performance such as the timing resolution, radiation hardness, and tracking performance of minimum ionising particles.

physics.ins-det

Anderson Delocalization in Strongly Coupled Disordered Non-Hermitian Chains

Disorder and non-Hermitian effects together can upend how waves localize. In a 1D disordered chain, the non-Hermitian skin effect (NHSE) can induce Anderson delocalization, defying the usual rule that disorder in low dimensions always localizes states. While weak disorder leaves the NHSE intact, strong disorder restores Anderson localization. Here, we study a surprising twist: coupling a strongly disordered Hatano-Nelson chain to a disordered Hermitian chain with their disorder anti-symmetrically correlated. Strikingly, once the inter-chain coupling exceeds a threshold, the system undergoes Anderson delocalization irrespective of disorder strength, reinstating the NHSE with no Hermitian counterpart. This transition arises from the interplay of non-reciprocal hopping, inter-chain coupling, and engineered disorder correlations, and is captured by a real-space winding number. To confirm this, we build an electrical-circuit analog and directly observe the re-emergent NHSE via voltage measurements. Our work uncovers unexplored and experimentally accessible physics at the crossroads of non-Hermiticity and disorder.

cond-mat.dis-nn

Beam test result and digitization of TaichuPix-3: A Monolithic Active Pixel Sensors for CEPC vertex detector

The Circular Electron-Positron Collider (CEPC), as the next-generation electron-positron collider, is tasked with advancing not only Higgs physics but also the discovery of new physics. Achieving these goals requires high-precision measurements of particles. Taichu seires, Monolithic Active Pixel Sensor (MAPS), a key component of the vertex detector for CEPC was designed to meet the CEPC's requirements. For the geometry of vertex detector is long barrel with no endcap, and current silicon lacks a complete digitization model, precise estimation of cluster size particularly causing by particle with large incident angle is needed. Testbeam results were conducted at the Beijing Synchrotron Radiation Facility (BSRF) to evaluate cluster size dependence on different incident angles and threshold settings. Experimental results confirmed that cluster size increases with incident angle. Simulations using the Allpix$^2$ framework replicated experimental trends at small angles but exhibited discrepancies at large angles, suggesting limitations in linear electric field assumptions and sensor thickness approximations. The results from both testbeam and simulations have provided insights into the performance of the TaichuPix chip at large incident angles, offering a crucial foundation for the establishment of a digital model and addressing the estimation of cluster size in the forward region of the long barrel. Furthermore, it offers valuable references for future iterations of TaichuPix, the development of digital models, and the simulation and estimation of the vertex detector's performance.

physics.ins-det

Experimental Observation of Topological Disclination States in Lossy Electric Circuits

Topological phase transitions can be remarkably induced purely by manipulating gain and loss mechanisms, offering a novel approach to engineering topological properties. Recent theoretical studies have revealed gain-loss-induced topological disclination states, along with the associated fractional charge trapped at the disclination sites. Here, we present the experimental demonstration of topological disclination states in a purely lossy electric circuit. By designing alternating lossy electric circuit networks that correspond to the disclination lattice, we observe a voltage response localized at the disclination sites and demonstrate the robustness of these states against disorder. Furthermore, we measure the charge distribution, confirming the presence of fractional charge at the disclination sites, which gives rise to the topological disclination states. Our experiment provides direct evidence of gain-loss-induced topological disclination states in electric circuits, opening new possibilities for applications in classical systems.

cond-mat.mes-hall

Hochschild cohomology for free semigroup algebras

This paper focuses on the cohomology of operator algebras associated with the free semigroup generated by the set $\{z_α\}_{α\inΛ}$, with the left regular free semigroup algebra $\mathfrak{L}_Λ$ and the non-commutative disc algebra $\mathfrak{A}_Λ$ serving as two typical examples. We establish that all derivations of these algebras are automatically continuous. By introducing a novel computational approach, we demonstrate that the first Hochschild cohomology group of $\mathfrak{A}_Λ$ with coefficients in $\mathfrak{L}_Λ$ is zero. Utilizing the Cesàro operators and conditional expectations, we show that the first normal cohomology group of $\mathfrak{L}_Λ$ is trivial. Finally, we prove that the higher cohomology groups of the non-commutative disc algebras with coefficients in the complex field vanish when $|Λ|<\infty$. These methods extend to compute the cohomology groups of a specific class of operator algebras generated by the left regular representations of cancellative semigroups, which notably include Thompson's semigroup.

math.OA

Beam test of a baseline vertex detector prototype for CEPC

The Circular Electron Positron Collider (CEPC) has been proposed to enable more thorough and precise measurements of the properties of Higgs, W, and Z bosons, as well as to search for new physics. In response to the stringent performance requirements of the vertex detector for the CEPC, a baseline vertex detector prototype was tested and characterized for the first time using a 6 GeV electron beam at DESY II Test Beam Line 21. The baseline vertex detector prototype is designed with a cylindrical barrel structure that contains six double-sided detector modules (ladders). Each side of the ladder includes TaichuPix-3 sensors based on Monolithic Active Pixel Sensor (MAPS) technology, a flexible printed circuit, and a carbon fiber support structure. Additionally, the readout electronics and the Data Acquisition system were also examined during this beam test. The performance of the prototype was evaluated using an electron beam that passed through six ladders in a perpendicular direction. The offline data analysis indicates a spatial resolution of about 5 um, with detection efficiency exceeding 99 % and an impact parameter resolution of about 5.1 um. These promising results from this baseline vertex detector prototype mark a significant step toward realizing the optimal vertex detector for the CEPC.

physics.ins-det

Beam test of a 180 nm CMOS Pixel Sensor for the CEPC vertex detector

The proposed Circular Electron Positron Collider (CEPC) imposes new challenges for the vertex detector in terms of pixel size and material budget. A Monolithic Active Pixel Sensor (MAPS) prototype called TaichuPix, based on a column drain readout architecture, has been developed to address the need for high spatial resolution. In order to evaluate the performance of the TaichuPix-3 chips, a beam test was carried out at DESY II TB21 in December 2022. Meanwhile, the Data Acquisition (DAQ) for a muti-plane configuration was tested during the beam test. This work presents the characterization of the TaichuPix-3 chips with two different processes, including cluster size, spatial resolution, and detection efficiency. The analysis results indicate the spatial resolution better than 5 $μm$ and the detection efficiency exceeds 99.5 % for both TaichuPix-3 chips with the two different processes.

physics.ins-det