arXiv subjects

Yanpeng Gong

Publications and source records attributed to Yanpeng Gong.

3 recordsLinked to original sources

arXiv2026

Physics-Informed Kolmogorov-Arnold Networks for multi-material elasticity problems in electronic packaging

This paper proposes a Physics-Informed Kolmogorov-Arnold Network for analyzing elasticity problems in multi-material electronic packaging structures. The method replaces traditional Multi-Layer Perceptrons with Kolmogorov-Arnold Networks within an energy-based Physics-Informed Neural Network framework. By constructing admissible displacement fields satisfying essential boundary conditions and optimizing network parameters through numerical integration, the proposed method effectively handles material property discontinuities. Unlike traditional methods that require domain decomposition and interface constraints for multi-material problems, Kolmogorov-Arnold Networks' trainable B-spline activation functions provide inherent piecewise characteristics. This capability stems from B-splines' local support, which enables effective approximation of discontinuities despite their individual smoothness. Consequently, this approach enables accurate approximation across the entire domain using a single network and simplifying the computational framework. Numerical experiments demonstrate that the proposed method achieves excellent accuracy and robustness in multi-material elasticity problems, validating its practical potential for electronic packaging analysis. Source codes are available at https://github.com/yanpeng-gong/PIKAN-MultiMaterial.

math.NA↗

arXiv2025

A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computational domains strategically, employing FEM for regular geometries to maximize computational efficiency and VEM for complex shapes to enhance geometric flexibility. Interface compatibility is maintained through coincident nodal correspondence, ensuring solution continuity across domain boundaries while reducing meshing complexity and computational overhead. Validation through electronic packaging applications demonstrates reasonable agreement with reference solutions and acceptable convergence characteristics across varying mesh densities. The method effectively captures thermal distributions and stress concentrations in multi-material systems, establishing a practical computational framework for electronic packaging analysis involving complex geometries. Source codes are available at https://github.com/yanpeng-gong/FeVeCoupled-ElectronicPackaging.

math.NA↗

arXiv2025

Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features

This paper presents two approaches: the virtual element method (VEM) and the stabilization-free virtual element method (SFVEM) for analyzing thermomechanical behavior in electronic packaging structures with geometric multi-scale features. Since the virtual element method allows the use of arbitrary polygonal elements, the inherent mesh flexibility of VEM allows localized mesh modifications without affecting global mesh structure, making it particularly effective for the analysis of electronic packaging reliability involving complex geometries and multiple geometric scales. The approach implements a novel non-matching mesh generation strategy that strategically combines polygonal meshes for complex small-scale regions with regular quadrilateral meshes for larger domains. The VEM formulation addresses both heat conduction and thermomechanical coupling problems, with comprehensive verification through analytical benchmarks and practical electronic packaging case studies, including Through-Silicon Via (TSV), Ball Grid Array (BGA), and Plastic Ball Grid Array (PBGA) structures. Results demonstrate that the method accurately captures stress concentrations at material interfaces and provides reliable thermal and mechanical response predictions. Some MATLAB codes for the numerical examples are provided at https://github.com/yanpeng-gong/VEM-electronic-packaging and on the VEMhub website (www.vemhub.com).

math.NA↗