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Yawen Qi

Publications and source records attributed to Yawen Qi.

3 recordsLinked to original sources

Breaking the trade-off between invisibility and sensitivity in electromagnetic sensing

Weak electromagnetic signals demand highly sensitive sensors, yet increasing a sensor's sensitivity inevitably strengthens its interaction with the surrounding field, producing scattering that perturbs the very signals being measured. Conversely, existing cloaking strategies suppress scattering only by isolating the sensor from incident waves, thereby compromising signal reception. Resolving this long-standing trade-off between invisibility and sensitivity has remained an outstanding challenge. Here we overcome this dilemma through an integrated transformation-optical architecture that co-designs the entire sensing system, including the electrically large sensor body, the subwavelength sensing probe, and their electrical interconnection. The proposed multifunctional core-shell structure guides incident waves around the sensor body while simultaneously concentrating them into the sensing region without disturbing the external electromagnetic field. A deep-subwavelength aperture preserves electrical connectivity without degrading either cloaking or field concentration, enabling invisible sensing within a single platform. A microwave prototype based on practical optic-null-medium metamaterials experimentally demonstrates broadband scattering suppression exceeding 3 dB together with an average sixfold enhancement of the detected signal over 4.9-5.1 GHz. By simultaneously eliminating measurement-induced field perturbation and amplifying the local sensing field, our approach establishes a general framework for invisible yet highly responsive electromagnetic sensors, opening new opportunities for weak-signal detection in biomedical diagnostics, secure communications, quantum technologies, and deep-space exploration.

physics.optics

Decoupling heat and electricity: A thermal invisible gateway

The Wiedemann-Franz law couples electrical and thermal conductivity, making high electrical conduction with low thermal conduction a major challenge. To overcome this, we designed an active thermal metasurface (ATMS) - based thermal invisible gateway that decouples thermal and electrical paths. Built on a copper substrate with a dumbbell-shaped bridge, the structure suppresses heat flow via directional compensation while allowing unimpeded electrical conduction. Room-temperature experiments show an effective thermal conductivity below 10^-3 W m^-1 K^-1 (near zero, air-like insulation) and an electrical conductivity up to 2.8x10^7 S m^-1 (metal-level). Unlike conventional material-modification approaches, our work uses macroscopic structural design to break the intrinsic coupling, offering a promising solution for applications like on-chip interconnects and wearable electronics.

physics.app-ph

Thermal superscatterer: amplification of thermal scattering signatures for arbitrarily shaped thermal materials

The concept of superscattering is extended to the thermal field through the design of a thermal superscatterer based on transformation thermodynamics. A small thermal scatterer of arbitrary shape and conductivity is encapsulated with an engineered negative-conductivity shell, creating a composite that mimics the scattering signature of a significantly larger scatterer. The amplified signature can match either a conformal larger scatterer (preserving conductivity) or a geometry-transformed one (modified conductivity). The implementation employs a positive-conductivity shell integrated with active thermal metasurfaces, demonstrated through three representative examples: super-insulating thermal scattering, super-conducting thermal scattering, and equivalent thermally transparent effects. Experimental validation shows the fabricated superscatterer amplifies the thermal scattering signature of a small insulated circular region by nine times, effectively mimicking the scattering signature of a circular region with ninefold radius. This approach enables thermal signature manipulation beyond physical size constraints, with potential applications in thermal superabsorbers/supersources, thermal camouflage, and energy management.

physics.app-ph