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Yunhui Fu

Publications and source records attributed to Yunhui Fu.

3 recordsLinked to original sources

Exponential Lower Bounds for Products of Cubic Polynomials over Prime Fields

We study exact representations of explicit signed modular predicates on $\{-1,1\}^n$ as products of bounded-degree polynomials over prime fields, measured by total variable-occurrence cost. Our main result is an exponential lower bound for products of cubic polynomials. Over $\mathbb F_3$ the proof is self-contained: every cubic factor in a nonvanishing product is a unit on the sign cube, the unit identity forces bounded affine-observation complexity, and a simultaneous clustering argument converts this structural compression into an exponential occurrence lower bound. We also give an alternative reconstruction route that isolates the quadratic structure behind the cubic classification. We then extend the cubic theorem to every fixed prime field $\mathbb F_p$ of characteristic greater than three for odd target modulus $q$ coprime to $p$. The only non-elementary structural input in this extension is Karam's restricted-range rank theorem; the conversion from multiplication to parity and the $p$-tuple clustering argument are proved explicitly. Finally, we establish a coefficient-field-independent degree-lifting principle. If a lower bound is known at one fixed degree, restriction to a large independent set yields a quantitative lower bound at the next degree. In particular, the exponential cubic theorem implies $ L^{(p,q)}_4(n)=Ω_{p,q}\!\left(\frac{n^4}{(\log(2+n))^3}\right). $ For the characteristic-three core this already gives a lower bound for a restricted mixed-modulus circuit class.

cs.CC↗

Sublinear Time Motif Discovery from Multiple Sequences

A natural probabilistic model for motif discovery has been used to experimentally test the quality of motif discovery programs. In this model, there are $k$ background sequences, and each character in a background sequence is a random character from an alphabet $Σ$. A motif $G=g_1g_2...g_m$ is a string of $m$ characters. Each background sequence is implanted a probabilistically generated approximate copy of $G$. For a probabilistically generated approximate copy $b_1b_2...b_m$ of $G$, every character $b_i$ is probabilistically generated such that the probability for $b_i\neq g_i$ is at most $α$. We develop three algorithms that under the probabilistic model can find the implanted motif with high probability via a tradeoff between computational time and the probability of mutation. The methods developed in this paper have been used in the software implementation. We observed some encouraging results that show improved performance for motif detection compared with other softwares.

cs.DS↗

Temperature 1 Self-Assembly: Deterministic Assembly in 3D and Probabilistic Assembly in 2D

We investigate the power of the Wang tile self-assembly model at temperature 1, a threshold value that permits attachment between any two tiles that share even a single bond. When restricted to deterministic assembly in the plane, no temperature 1 assembly system has been shown to build a shape with a tile complexity smaller than the diameter of the shape. In contrast, we show that temperature 1 self-assembly in 3 dimensions, even when growth is restricted to at most 1 step into the third dimension, is capable of simulating a large class of temperature 2 systems, in turn permitting the simulation of arbitrary Turing machines and the assembly of $n\times n$ squares in near optimal $O(\log n)$ tile complexity. Further, we consider temperature 1 probabilistic assembly in 2D, and show that with a logarithmic scale up of tile complexity and shape scale, the same general class of temperature $τ=2$ systems can be simulated with high probability, yielding Turing machine simulation and $O(\log^2 n)$ assembly of $n\times n$ squares with high probability. Our results show a sharp contrast in achievable tile complexity at temperature 1 if either growth into the third dimension or a small probability of error are permitted. Motivated by applications in nanotechnology and molecular computing, and the plausibility of implementing 3 dimensional self-assembly systems, our techniques may provide the needed power of temperature 2 systems, while at the same time avoiding the experimental challenges faced by those systems.

cs.CC↗