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Yunpeng Lu

Publications and source records attributed to Yunpeng Lu.

7 recordsLinked to original sources

Further Characterization of the JadePix-3 CMOS Pixel Sensor for the CEPC Vertex Detector: in Dependence of Substrate Reverse Bias

The Circular Electron-Positron Collider (CEPC), a proposed next-generation $e^+e^-$ collider to enable high-precision studies of the Higgs boson and potential new physics, imposes rigorous demands on detector technologies, particularly the vertex detector. JadePix-3 is a prototype Monolithic Active Pixel Sensor (MAPS) designed for the CEPC vertex detector. This paper presents a detailed laboratory-based characterization of the JadePix-3 sensor, focusing on the previously under-explored effects of substrate reverse bias voltage on key performance metrics: charge collection efficiency, average cluster size, and hit efficiency of laser. Systematic testing demonstrated that JadePix-3 operates reliably under reverse bias, exhibiting a reduced input capacitance, an expanded depletion region, enhanced charge collection efficiency, and a lower fake-hit rate. These findings confirm the sensor's potential for high-precision particle tracking and vertexing at the CEPC while offering valuable references for future iterational R\&D of the JadePix series.

physics.ins-det

Performance study of the JadePix-3 telescope from a beam test

We present the results of a beam test conducted on a telescope using the JadePix-3 pixel sensor, developed with TowerJazz 180 nm CMOS imaging technology. The telescope is composed of five planes, each equipped with a JadePix-3 sensor with pitches of 26 um x 16 um and 23.11 um x 16 um. In addition, it features an FPGA-based synchronous readout system. The telescope underwent testing using an electron beam with energy ranging from 4 to 6 GeV. At an electron energy of 5.4 GeV, the telescope demonstrated superior spatial resolutions of 2.6 and 2.3 um in two dimensions. By designating the central plane as the device under test, we evaluated the JadePix-3 sensor's spatial resolutions as 5.2 and 4.6 um in two dimensions, achieving a detection efficiency of over 99%.

hep-ex

The DAQ and control system for JadePix3

The silicon pixel sensor is the core component of the vertex detector for the Circular Electron Positron Collider~(CEPC). The JadePix3 is a full-function large-size CMOS chip designed for the CEPC vertex detector. To test all the functions and the performance of this chip, we designed a test system based on the IPbus framework. The test system controls the parameters and monitors the status of the pixel chip. By integrating the jumbo frame feature into the IPbus suite, the block read/write speed is further extended in order to meet the specifications of the JadePix3. The robustness, scalability, and portability of this system have been verified by pulse test, cosmic test and laser test in the laboratory. This paper summarizes the DAQ and control system of the JadePix3 and presents the first results of the tests.

physics.ins-det

Characterization of SOI pixel sensor using pinned depleted diode structure with AC-coupling on the diode

The experiment of the future electron-positron colliders has unprecedented requirements on the vertex resolution, such as around 3micron single point resolution for the inner most detector layer, with fast readout, and very low power-consumption density and material budget. Significant efforts have been put into the development of monolithic silicon pixel sensors, but there have been some challenges to combine all those stringent specifications in a small pixel area. This paper presents a compact prototype pixel sensor fabricated in LAPIS 200nm SOI process and focuses on the characterization of low capacitance of the sensing node with a pinned depleted diode structure adopting a novel method of forward bias voltage and AC coupling on the diode. Three PDD structures with 16 micron by 20 micron pixel size were designed and compared using radioactive sources and injected charge. The measured result shows that the designed PDD structure has very low leakage current and around 3.5fF of equivalent input capacitance.

physics.ins-det

Weighted persistent homology for biomolecular data analysis

In this paper, we systematically review weighted persistent homology (WPH) models and their applications in biomolecular data analysis. Essentially, the weight value, which reflects physical, chemical and biological properties, can be assigned to vertices (atom centers), edges (bonds), or higher order simplexes (cluster of atoms), depending on the biomolecular structure, function, and dynamics properties. Further, we propose the first localized weighted persistent homology (LWPH). Inspired by the great success of element specific persistent homology (ESPH), we do not treat biomolecules as an inseparable system like all previous weighted models, instead we decompose them into a series of local domains, which may be overlapped with each other. The general persistent homology or weighted persistent homology analysis is then applied on each of these local domains. In this way, functional properties, that are embedded in local structures, can be revealed. Our model has been applied to systematically studying DNA structures. It has been found that our LWPH based features can be used to successfully discriminate the A-, B-, and Z-types of DNA. More importantly, our LWPH based PCA model can identify two configurational states of DNA structure in ion liquid environment, which can be revealed only by the complicated helical coordinate system. The great consistence with the helical-coordinate model demonstrates that our model captures local structure variations so well that it is comparable with geometric models. Moreover, geometric measurements are usually defined in very local regions. For instance, the helical-coordinate system is limited to one or two basepairs. However, our LWPH can quantitatively characterize structure information in local regions or domains with arbitrary sizes and shapes, where traditional geometrical measurements fail.

q-bio.BM

A study on the shielding mechanisms of SOI pixel detector

In order to tackle the charge injection issue that had perplexed the counting type SOI pixel for years, two successive chips CPIXTEG3 and CPIXTEG3b were developed utilizing two shielding mechanisms, Nested-well and Double-SOI, in the LAPIS process. A TCAD simulation showed the shielding effectiveness influenced by the high sheet resistance of shielding layers. Test structures specially designed to measure the crosstalk associated to charge injection were implemented in CPIXTEG3/3b. Measurement results proved that using shielding layer is indispensable for counting type pixel and Double-SOI is superior to Nested-well in terms of shielding effectiveness and design flexibility.

physics.ins-det

Test of a fine pitch SOI pixel detector with laser beam

A silicon pixel detector with fine pitch size of 19x19 um, developed base on SOI (silicon on insulator) technology, was tested under the illumination of infrared laser pulses. As an alternative way to particle beam tests, the laser pulses were tuned to very short duration and small transverse profile to simulate the tracks of MIPs (minimum ionization particles) in silicon. Hit cluster sizes were measured with focused laser pulses propagating through the SOI detector perpendicular to its surface and most of the induced charge was found to be collected inside the seed pixel. For the first time, the signal amplitude as a function of the applied bias voltage was measured for this SOI detector, deepening understanding of its depletion characteristics.

physics.ins-det