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Yunzhen Wang

Publications and source records attributed to Yunzhen Wang.

2 recordsLinked to original sources

Self-Supervised One-Step Diffusion Refinement for Snapshot Compressive Imaging

Snapshot compressive imaging (SCI) captures multispectral images (MSIs) using a single coded two-dimensional (2-D) measurement, but reconstructing high-fidelity MSIs from these compressed inputs remains a fundamentally ill-posed challenge. While diffusion-based reconstruction methods have recently raised the bar for quality, they face critical limitations: a lack of large-scale MSI training data, adverse domain shifts from RGB-pretrained models, and inference inefficiencies due to multi-step sampling. These drawbacks restrict their practicality in real-world applications. In contrast to existing methods, which either follow costly iterative refinement or adapt subspace-based embeddings for diffusion models (e.g. DiffSCI, PSR-SCI), we introduce a fundamentally different paradigm: a self-supervised One-Step Diffusion (OSD) framework specifically designed for SCI. The key novelty lies in using a single-step diffusion refiner to correct an initial reconstruction, eliminating iterative denoising entirely while preserving generative quality. Moreover, we adopt a self-supervised equivariant learning strategy to train both the predictor and refiner directly from raw 2-D measurements, enabling generalization to unseen domains without the need for ground-truth MSI. To further address the challenge of limited MSI data, we design a band-selection-driven distillation strategy that transfers core generative priors from large-scale RGB datasets, effectively bridging the domain gap. Extensive experiments confirm that our approach sets a new benchmark, yielding PSNR gains of 3.44 dB, 1.61 dB, and 0.28 dB on the Harvard, NTIRE, and ICVL datasets, respectively, while reducing reconstruction time by 97.5%. This remarkable improvement in efficiency and adaptability makes our method a significant advancement in SCI reconstruction, combining both accuracy and practicality for real-world deployment.

eess.IV

Unveiling the delicate "hidden" interface conditions in WS2 flakes by advanced atomic force microscopy

The delicate interfacial conditions and behaviors play critical roles in determining the valuable physical properties of two-dimensional materials and their heterostructures on substrates. However, directly probing these complex interface conditions remains challenging. Here, we reveal the coupled in-plane strain and out-of-plane bonding conditions in strain-engineered WS2 flakes by combining dual-harmonic electrostatic force microscopy (DH-EFM) and scanning microwave impedance microscopy (sMIM). A striking contradiction is observed between the compressive-strain-induced larger bandgap (lower electrical conductivity) detected by DH-EFM, and the enhanced conductivity probed by sMIM. Comparative measurements under different sMIM modes demonstrate that this contradiction originates from a tip-loading-force-induced dynamic puckering effect, which is governed by the interfacial bonding strength. Furthermore, the progressive accumulation and subsequent release of conductivity during forward/backward sMIM-contact scans further confirms this dynamic puckering behavior, revealing pronounced differences in interface conditions between the open- and closed-ring regions of WS2. This work resolves the correlation between electrical properties and interface conditions, and provides fundamental insights for interface-engineered devices.

cond-mat.mtrl-sci