arXiv subjects

Yuriy Shlepnev

Publications and source records attributed to Yuriy Shlepnev.

3 recordsLinked to original sources

arXiv2024

Progress in Decompositional Electromagnetic Analysis of Digital Interconnects

In the realm of PCB and packaging interconnect design, electromagnetic analysis tools have transitioned from optional to essential over the last two decades, as data rates soared beyond 6 Gbps. Today, with standard data rates eclipsing 6 Gbps and reaching thresholds of 224 Gbps, these tools are indispensable for designing reliable interconnects. The goals of the interconnect analysis are simple: identify interconnects that may fail at the target data rate and allow troubleshooting and fixing the problem. The most efficient approach to such pass-fail analysis is the Decompositional Electromagnetic Analysis (DEA). It allows separation of the signal degradation factors for faster analysis and troubleshooting. This paper outlines the basic elements of DEA, discusses conditions for its accuracy and underscores its significance in the future of interconnect design.

physics.ins-det↗

arXiv2022

Evaluation of Delay Uncertainty in PCB Interconnects Due to Fiber Weave Effect

Delay Deviation Exceedance (DDE) and Differential Skew Exceedance (DSE) measures are proposed to quantify delay uncertainty in single-ended and differential PCB interconnects arising from Fiber Weave Effect (FWE). DDE and DSE are constructed with 3D EM analysis of traces over inhomogeneous dielectric with glass fiber bundles in resin. Measurements or 3D EM models for FWE are usually used for observations of delay or impedance dependency on position of traces over fiber bundles with the purpose to find the worst case scenario. This paper turns the results of 3D EM analysis into probabilistic measures of possible delay or skew uncertainty - probability to have delay deviation in single-ended interconnects over allowed limit (DDE measure) or to have skew over allowed limit in differential interconnects (DSE measure). The introduced measures allow formalizing the laminate selection process for parallel as well as for serial PCB interconnects.

eess.SP↗

arXiv2021

Evaluation of S-Parameters Similarity with Modified Hausdorff Distance

A new similarity measure for two sets of S-parameters is proposed. It is constructed with the modified Hausdorff distance applied to S-parameter points in 3D space with real, imaginary and normalized frequency axes. New S-parameters similarity measure facilitates automation of the analysis to measurement validation, comparison of models and measurements obtained with different tools, as well as finding similar S-parameter models or similar elements within S-matrices.

math-ph↗