@misc{indiciae95a17f567115,
  title = {Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors},
  author = {S. Kondo and Qiang Yu and T. Shibutani and M. Shiratori},
  year = {2007},
  url = {https://arxiv.org/abs/0709.1872},
  note = {Source identifier: 0709.1872}
}