TY  - RPRT
TI  - Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors
AU  - S. Kondo
AU  - Qiang Yu
AU  - T. Shibutani
AU  - M. Shiratori
PY  - 2007
UR  - https://arxiv.org/abs/0709.1872
ID  - 0709.1872
ER  -