TY  - RPRT
TI  - A Novel Contact Resistance Model of Anisotropic Conductive Film for FPD Packaging
AU  - Gou-Jen Wang
AU  - Yi-Chin Lin
AU  - Gwo-Sen Lin
PY  - 2007
UR  - https://arxiv.org/abs/0711.3304
ID  - 0711.3304
ER  -