@misc{indiciae924d92e3bf06,
  title = {Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications},
  author = {Jeong-Won Yoon and H. -S. Chun and Ja-Myeong Koo and Seung-Boo Jung},
  year = {2007},
  url = {https://arxiv.org/abs/0711.3323},
  note = {Source identifier: 0711.3323}
}