TY  - RPRT
TI  - Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
AU  - Jeong-Won Yoon
AU  - H. -S. Chun
AU  - Ja-Myeong Koo
AU  - Seung-Boo Jung
PY  - 2007
UR  - https://arxiv.org/abs/0711.3323
ID  - 0711.3323
ER  -