TY  - RPRT
TI  - An SERS study of the galvanostatic sequence employed for the electrochemical deposition of Copper in the fabrication of Interconnects
AU  - Lucia DUrzo
AU  - Benedetto Bozzini
PY  - 2007
UR  - https://arxiv.org/abs/0801.0098
ID  - 0801.0098
ER  -