@misc{indiciae5d0a07f6415d,
  title = {Evaluation of the impact of solder die attach versus epoxy die attach in a state of the art power package},
  author = {J. Czernohorsky and B. Maj and Matthias Viering and L. Wright and G. Balanon},
  year = {2008},
  url = {https://arxiv.org/abs/0801.1003},
  note = {Source identifier: 0801.1003}
}