@misc{indiciae396587fda879,
  title = {New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors},
  author = {Satoshi Kondo and Qiang Yu and T. Shibutani and M. Shiratori},
  year = {2008},
  url = {https://arxiv.org/abs/0801.1004},
  note = {Source identifier: 0801.1004}
}