TY  - RPRT
TI  - New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors
AU  - Satoshi Kondo
AU  - Qiang Yu
AU  - T. Shibutani
AU  - M. Shiratori
PY  - 2008
UR  - https://arxiv.org/abs/0801.1004
ID  - 0801.1004
ER  -