@misc{indiciae6fe31fc28990,
  title = {Formation of Embedded Microstructures by Thermal Activated Solvent Bonding},
  author = {S. H. Ng and R. T. Tjeung and Z. F. Wang and A. C. W. Lu and I. Rodriguez and N. De Rooij},
  year = {2008},
  url = {https://arxiv.org/abs/0802.3064},
  note = {Source identifier: 0802.3064}
}