@misc{indiciaef6b2be818ab9,
  title = {Novel Bonding technologies for wafer-level transparent packaging of MOEMS},
  author = {H. Kirchberger and P. Lindler and M. Wimpliger},
  year = {2008},
  url = {https://arxiv.org/abs/0802.3103},
  note = {Source identifier: 0802.3103}
}