TY  - RPRT
TI  - Novel Bonding technologies for wafer-level transparent packaging of MOEMS
AU  - H. Kirchberger
AU  - P. Lindler
AU  - M. Wimpliger
PY  - 2008
UR  - https://arxiv.org/abs/0802.3103
ID  - 0802.3103
ER  -