@misc{indiciae218052daaf2a,
  title = {Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab},
  author = {M. Trimpl and E. Skup and R. Yarema and J. C. Yun},
  year = {2009},
  doi = {10.1088/1748-0221/4/11/t11001},
  url = {https://arxiv.org/abs/0911.0021},
  note = {Source identifier: 0911.0021}
}