TY  - RPRT
TI  - Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab
AU  - M. Trimpl
AU  - E. Skup
AU  - R. Yarema
AU  - J. C. Yun
PY  - 2009
DO  - 10.1088/1748-0221/4/11/t11001
UR  - https://arxiv.org/abs/0911.0021
ID  - 0911.0021
ER  -