@misc{indiciae665e02bdca2f,
  title = {Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage \& Strain in Fully Encapsulated Integrated Circuits},
  author = {J. Stopford and A. Henry and D. Allen and N. Bennett and D. Manessis and L. Boettcher and J. Wittge and A. N. Danilewsky and P. J. McNally},
  year = {2012},
  url = {https://arxiv.org/abs/1204.1466},
  note = {Source identifier: 1204.1466}
}