TY  - RPRT
TI  - Three Dimensionial Surface Modelling: A Novel Analysis Technique for Non-Destructive X-Ray Diffraction Imaging of Semiconductor Die Warpage & Strain in Fully Encapsulated Integrated Circuits
AU  - J. Stopford
AU  - A. Henry
AU  - D. Allen
AU  - N. Bennett
AU  - D. Manessis
AU  - L. Boettcher
AU  - J. Wittge
AU  - A. N. Danilewsky
AU  - P. J. McNally
PY  - 2012
UR  - https://arxiv.org/abs/1204.1466
ID  - 1204.1466
ER  -