TY  - RPRT
TI  - Modelling and simulation of adhesive curing processes in bonded piezo metal composites
AU  - Ralf Landgraf
AU  - Martin Rudolph
AU  - Robert Scherzer
AU  - Jörn Ihlemann
PY  - 2014
DO  - 10.1007/s00466-014-1005-5
UR  - https://arxiv.org/abs/1310.8264
ID  - 1310.8264
ER  -