@misc{indiciaef497f029cc61,
  title = {Thermal Interface Conductance between Aluminum and Silicon by Molecular Dynamics Simulations},
  author = {Nuo Yang and Tengfei Luo and Keivan Esfarjani and Asegun Henry and Zhiting Tian and Junichiro Shiomi and Yann Chalopin and Baowen Li and Gang Chen},
  year = {2014},
  doi = {10.1166/jctn.2015.3710},
  url = {https://arxiv.org/abs/1401.5550},
  note = {Source identifier: 1401.5550}
}