@misc{indiciae4d323f956d95,
  title = {Oxidation of copper during physical sputtering deposition: mechanism, avoidance and utilization},
  author = {Jiangbin Su and Yang Liu and Meiping Jiang and Xianfang Zhu},
  year = {2014},
  doi = {10.1007/s40843-016-0125-y},
  url = {https://arxiv.org/abs/1412.2031},
  note = {Source identifier: 1412.2031}
}