TY  - RPRT
TI  - Oxidation of copper during physical sputtering deposition: mechanism, avoidance and utilization
AU  - Jiangbin Su
AU  - Yang Liu
AU  - Meiping Jiang
AU  - Xianfang Zhu
PY  - 2014
DO  - 10.1007/s40843-016-0125-y
UR  - https://arxiv.org/abs/1412.2031
ID  - 1412.2031
ER  -