TY  - RPRT
TI  - ePlace-3D: Electrostatics based Placement for 3D-ICs
AU  - Jingwei Lu
AU  - Hao Zhuang
AU  - Ilgweon Kang
AU  - Pengwen Chen
AU  - Chung-Kuan Cheng
PY  - 2016
DO  - 10.1145/2872334.2872361
UR  - https://arxiv.org/abs/1512.08291
ID  - 1512.08291
ER  -