@misc{indiciaed47efcd74cea,
  title = {When to use 3D Die-Stacked Memory for Bandwidth-Constrained Big Data Workloads},
  author = {Jason Lowe-Power and Mark D. Hill and David A. Wood},
  year = {2016},
  url = {https://arxiv.org/abs/1608.07485},
  note = {Source identifier: 1608.07485}
}