@misc{indiciae84babce0cc62,
  title = {Determination of Bond Wire Failure Probabilities in Microelectronic Packages},
  author = {Thorben Casper and Ulrich Römer and Sebastian Schöps},
  year = {2017},
  doi = {10.1109/therminic.2016.7748645},
  url = {https://arxiv.org/abs/1609.06187},
  note = {Source identifier: 1609.06187}
}