TY  - RPRT
TI  - Determination of Bond Wire Failure Probabilities in Microelectronic Packages
AU  - Thorben Casper
AU  - Ulrich Römer
AU  - Sebastian Schöps
PY  - 2017
DO  - 10.1109/therminic.2016.7748645
UR  - https://arxiv.org/abs/1609.06187
ID  - 1609.06187
ER  -