@misc{indiciaed5ee0fccefe0,
  title = {Grain Boundary Resistance in Copper Interconnects from an Atomistic Model to a Neural Network},
  author = {Daniel Valencia and Evan Wilson and Zhengping Jiang and Gustavo A. Valencia-Zapata and Gerhard Klimeck and Michael Povolotskyi},
  year = {2017},
  doi = {10.1103/physrevapplied.9.044005},
  url = {https://arxiv.org/abs/1701.04897},
  note = {Source identifier: 1701.04897}
}