TY  - RPRT
TI  - Grain Boundary Resistance in Copper Interconnects from an Atomistic Model to a Neural Network
AU  - Daniel Valencia
AU  - Evan Wilson
AU  - Zhengping Jiang
AU  - Gustavo A. Valencia-Zapata
AU  - Gerhard Klimeck
AU  - Michael Povolotskyi
PY  - 2017
DO  - 10.1103/physrevapplied.9.044005
UR  - https://arxiv.org/abs/1701.04897
ID  - 1701.04897
ER  -