@misc{indiciaed12cf90b0e65,
  title = {Thermocompression Bonding Technology for Multilayer Superconducting Quantum Circuits},
  author = {C. R. H. McRae and J. H. Béjanin and Z. Pagel and A. O. Abdallah and T. G. McConkey and C. T. Earnest and J. R. Rinehart and M. Mariantoni},
  year = {2017},
  doi = {10.1063/1.5003169},
  url = {https://arxiv.org/abs/1705.02435},
  note = {Source identifier: 1705.02435}
}