@misc{indiciae830612cf987c,
  title = {Two-Dimensional h-BN and MoS2 as Diffusion Barriers for Ultra-Scaled Copper Interconnects},
  author = {Chun-Li Lo and Massimo Catalano and Kirby K. H. Smithe and Luhua Wang and Shengjiao Zhang and Eric Pop and Moon J. Kim and Zhihong Chen},
  year = {2017},
  url = {https://arxiv.org/abs/1706.10178},
  note = {Source identifier: 1706.10178}
}