@misc{indiciae0c0eec62b412,
  title = {High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study},
  author = {Shouhang Li and Xiaoxiang Yu and Hua Bao and Nuo Yang},
  year = {2018},
  url = {https://arxiv.org/abs/1801.04391},
  note = {Source identifier: 1801.04391}
}