TY  - RPRT
TI  - High thermal conductivity of bulk epoxy resin by bottom-up parallel-linking and strain: a molecular dynamics study
AU  - Shouhang Li
AU  - Xiaoxiang Yu
AU  - Hua Bao
AU  - Nuo Yang
PY  - 2018
UR  - https://arxiv.org/abs/1801.04391
ID  - 1801.04391
ER  -