TY  - RPRT
TI  - Comparison of processing-induced deformations of InP bonded to Si determined by e-beam metrology: direct vs. adhesive bonding
AU  - Aurimas Sakanas
AU  - Elizaveta Semenova
AU  - Luisa Ottaviano
AU  - Jesper Mørk
AU  - Kresten Yvind
PY  - 2018
UR  - https://arxiv.org/abs/1808.06888
ID  - 1808.06888
ER  -