@misc{indiciaeaee4d73b3314,
  title = {Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging},
  author = {Thorben Casper and Ulrich Römer and Sebastian Schöps and Herbert De Gersem},
  year = {2018},
  doi = {10.1016/j.camwa.2019.10.009},
  url = {https://arxiv.org/abs/1809.09034},
  note = {Source identifier: 1809.09034}
}