TY  - RPRT
TI  - Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging
AU  - Thorben Casper
AU  - Ulrich Römer
AU  - Sebastian Schöps
AU  - Herbert De Gersem
PY  - 2018
DO  - 10.1016/j.camwa.2019.10.009
UR  - https://arxiv.org/abs/1809.09034
ID  - 1809.09034
ER  -