@misc{indiciae6311d3b31467,
  title = {Fiber to Chip Fusion Splicing for Robust, Low Loss Photonic Packaging},
  author = {Juniyali Nauriyal and Meiting Song and Raymond Yu and Jaime Cardenas},
  year = {2018},
  url = {https://arxiv.org/abs/1810.09531},
  note = {Source identifier: 1810.09531}
}