@misc{indiciaee9a20d1f9fd9,
  title = {3DCAM: A Low Overhead Crosstalk Avoidance Mechanism for TSV-Based 3D ICs},
  author = {Reza Mirosanlou and Mohammadkazem Taram and Zahra Shirmohammadi and Seyed-Ghassem Miremadi},
  year = {2019},
  url = {https://arxiv.org/abs/1901.00568},
  note = {Source identifier: 1901.00568}
}