@misc{indiciaeffd38426cd21,
  title = {Electromigration Response of Microjoints in 3DIC Packaging Systems},
  author = {Vahid Attari and Thien Duong and Raymundo Arroyave},
  year = {2019},
  url = {https://arxiv.org/abs/1905.09901},
  note = {Source identifier: 1905.09901}
}