@misc{indiciaed034721062cf,
  title = {In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint},
  author = {Tianhong Gu and Christopher M. Gourlay and T. Ben Britton},
  year = {2019},
  url = {https://arxiv.org/abs/1908.00401},
  note = {Source identifier: 1908.00401}
}