TY  - RPRT
TI  - In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5Cu/Cu solder joint
AU  - Tianhong Gu
AU  - Christopher M. Gourlay
AU  - T. Ben Britton
PY  - 2019
UR  - https://arxiv.org/abs/1908.00401
ID  - 1908.00401
ER  -