TY  - RPRT
TI  - Interfacial Thermal Conductance across Room-Temperature Bonded GaN-Diamond Interfaces for GaN-on-Diamond Devices
AU  - Zhe Cheng
AU  - Fengwen Mu
AU  - Luke Yates
AU  - Tadatomo Suga
AU  - Samuel Graham
PY  - 2019
UR  - https://arxiv.org/abs/1909.01556
ID  - 1909.01556
ER  -