@misc{indiciaebd0f835c456d,
  title = {3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements},
  author = {Katrin Hirmer and Thorben Casper and Sebastian Schöps and Klaus Hofmann},
  year = {2019},
  url = {https://arxiv.org/abs/1910.06831},
  note = {Source identifier: 1910.06831}
}