TY  - RPRT
TI  - 3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements
AU  - Katrin Hirmer
AU  - Thorben Casper
AU  - Sebastian Schöps
AU  - Klaus Hofmann
PY  - 2019
UR  - https://arxiv.org/abs/1910.06831
ID  - 1910.06831
ER  -