@misc{indiciae941168e9802b,
  title = {Topology optimization of heat sinks for instantaneous chip cooling using a transient pseudo-3D thermofluid model},
  author = {Tao Zeng and Hu Wang and Mengzhu Yang and Joe Alexandersen},
  year = {2019},
  doi = {10.1016/j.ijheatmasstransfer.2020.119681},
  url = {https://arxiv.org/abs/1911.12987},
  note = {Source identifier: 1911.12987}
}