TY  - RPRT
TI  - A barrier/seed system for electroless metallization on complex surfaces using (aminomethylaminoethyl)phenethyltrimethoxysilane self-assembled films
AU  - Jeremy K . L. Peters
AU  - Garon D. Ashby
AU  - Hans D. Hallen
PY  - 2020
UR  - https://arxiv.org/abs/2001.03295
ID  - 2001.03295
ER  -